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MediaTek has unveiled the Dimensity 8300 processor

MediaTek has unveiled the Dimensity 8300 processor

MediaTek has announced its newest 8000 series chipset, the Dimensity 8300. The new SoC is based on TSMC’s second-generation 4nm process and is a direct successor to last year’s Dimensity 8200, offering performance improvements across the board.

Dimensity 8300

The Dimensity 8300 features four high-performance Arm Cortex-A715 cores clocked up to 3.35GHz and four efficient Arm Cortex-A510 blocks clocked up to 2.2GHz. All eight cores are based on the Armv9 processor architecture. MediaTek claims that the processor’s performance has been increased by 20 percent and peak power efficiency by 30 percent, compared to the previous Dimensity 8200.

The processor’s performance has been increased by 20 percent and peak power efficiency by 30 percent, compared to the previous Dimensity 8200.


Dimensity 8300
Dimensity 8200Dimensity 8100
Node4 nm4 nm5 nm
CPU Prime1x Cortex-A715 @ 3.35 GHz1x Cortex-A78 @ 3.1 GHz
CPU Big3x Cortex-A715 @ 3.0 GHz4x Cortex-A78 @ 3.0 GHz4x Cortex-A78 @ 2.85 GHz
CPU Little4x Cortex-A510 @ 2.2 GHz4x Cortex-A55 @ 2.0 GHz4x Cortex-A55 @ 2.0 GHz
RAMLPDDR5X (up to 8,533Mbps)LPDDR5 (up to 6,400 Mbps)LPDDR5 (up to 6,400 Mbps)
StorageUFS 4.0 with MCQUFS 3.1UFS 3.1
GPUMali-G615 (60% faster than 8200)Mali-G610 MC6Mali-G610 MC6
DisplayFHD+ @ 180Hz, WQHD+ @ 120HzFHD+ @ 168Hz, WQHD+ @ 120HzFHD+ @ 180Hz, WQHD+ @ 120Hz
Camera (stills)320 MP320 MP200 MP
Camera (video)4K @ 60 fps (HDR10+)4K @ 60 fps (HDR10+)4K @ 60 fps (HDR10+)
5G5.17 Gbps downlink4.7 Gbps downlink4.7 Gbps downlink
Wi-FiWi-Fi 6E (2×2)Wi-Fi 6E (2×2)Wi-Fi 6E (2×2)
Bluetooth5.45.35.3

The new chip also features the Arm Mali-G615 MC6 GPU, which offers up to 60% performance boost and 55% energy efficiency at peak speeds, compared to its predecessor. MediaTek also claims that cold app launch is 17% faster and idle app launch is 47% faster thanks to the new chip. The new chip also supports quad-channel LPDDR5X RAM at 8533 Mbps and UFS 4.0 storage with Multi-Circular Queue (MCQ) support.

The new chip also supports quad-channel LPDDR5X RAM at 8533 Mbps and UFS 4.0 storage with Multi-Circular Queue (MCQ) support.

APU 780 inside the Dimensity 8300 makes it the first chip in its class to support generative artificial intelligence with stable propagation and support for LLM (up to 10 billion parameters).

AAPU 780 inside the Dimensity 8300 makes it the first chip in its class to support generative AI with stable propagation and support for LLM (up to 10 billion parameters).

The Imagiq 980 supports camera sensors up to 320MP and 4K video recording at 60fps.

Dimensity 8300

In addition, the Dimensity 8300 features an integrated 5G modem, Wi-Fi 6E and Bluetooth 5.4. The first smartphone to get the new chip will be the Redmi K70E.

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