A new Pixel 8 Pro leak has revealed details about the Tensor G3 chip
By ForGeeks Google is announcing the Pixel 8 series tomorrow, and we’ve already seen plenty of leaks, but here’s another one. M. Brandon Lee of This is Tech Today shared some images of the Pixel 8 Pro running in Device Info HW and AIDA64, which reveal detailed specs of the new Tensor G3 chip.
A few images of the Pixel 8 Pro running in Device Info HW and AIDA64 reveal detailed specs of the new Tensor G3 chip.
The Tensor G3 features a 9-core processor with a 2.91GHz Cortex-X3 main core, a 2.37GHz Cortex-A715 quad core and a 1.7GHz Cortex-A510 quad core. Another notable detail — Mali-G715 GPU and 12GB of RAM. The Tensor G3 is manufactured using Samsung’s 4nm process and utilizes FO-WLP packaging technology, which should result in lower heat dissipation and improved power efficiency compared to the Tensor G2.
The Tensor G3 is manufactured using Samsung’s 4nm process and utilizes FO-WLP packaging technology, which should result in lower heat dissipation and improved power efficiency compared to the Tensor G2.
Besides details about the chipset, the latest leak also confirms the presence of a Goodix optical fingerprint scanner embedded in the display panel. The Pixel 8 Pro is expected to feature a 6.7-inch LTPO OLED screen with QHD+ resolution and a refresh rate of 1-120Hz. The rear panel will feature a 50MP main camera, a 48MP telephoto lens with 5x optical zoom and a new 48MP ultrazoom.
The Pixel 8 Pro is expected to feature a 50MP main camera, a 48MP telephoto lens with 5x optical zoom and a new 48MP ultrazoom.
Android 14 is responsible for the software. The device will be available in Obsidian, Sky Blue and Porcelain colors. The Pixel 8 Pro is expected to be priced at $899
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