Microsoft unveiled a breakthrough in microfluidics
By ForGeeks
As AI chips get more powerful, they generate more heat. That’s a major obstacle to developing new devices, as conventional cooling systems are nearing their limit. Most data centers use systems where liquid flows through a plate attached to the chip. But these methods are inefficient because the heat is trapped in multiple layers, which reduces the cooling rate. A lot of data centers use systems where the liquid passes through a plate attached to the chip. Microsoft offers an innovative approach: microfluidics. Instead of traditional wafers, it uses thin fluid channels that can dissipate heat three times better! What’s more, the technology allows you to precisely direct coolant to where the chip is overheating most, with the help of artificial intelligence that tracks hot spots. Judy Priest, a Microsoft vice president, says: “Microfluidics will help create smaller and more powerful chips. This will open new horizons for AI development and data processing in a smaller space.” Tests have already shown impressive results: a 65% reduction in GPU temperature and efficient heat dissipation under high load. Most importantly, the new system can handle heat up to three times better than existing systems. Why it matters. Not only will the updated cooling systems keep more powerful sensors and servers running, but they’ll also help reduce energy costs. And that means greener, more energy-efficient data centers day after day. Microsoft is already working with Swiss startup Corintis to improve this technology and plans to roll it out in the future. This is just one example of how innovation is helping to combat overheating and accelerate the development of artificial intelligence. And there are even more opportunities for ultra-efficient, green data centers ahead.
