TSMC signs the largest chip manufacturing contract with the U.S.
By ForGeeks TSMC, a leading global semiconductor manufacturer, has signed an agreement with the U.S. government to receive a $6.6 billion subsidy and an additional $5 billion in loans to expand chip manufacturing in Arizona. This is the first major contract under the CHIPS and Science Act program, launched in 2022.
CHIPS and Science Act.
Details of the agreement
- Financing stages: The first $1 billion TSMC will receive by the end of this year. The remaining funds will be disbursed as project milestones are reached.
- Total investment: Through the contract, TSMC will invest $65 billion in the construction and development of three high-tech plants in the U.S.
- The scale of the project: This is the largest foreign investment in green building in U.S. history.
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Declarations and Goals
According to U.S. President Joe Biden:
«As early as next year, the U.S. plant will be producing advanced chips for smartphones, autonomous cars and AI data centers.»
TSMC’s plans in Arizona
- First fab: Production of chips using 4nm technology will begin in 2024.
- Second fab: Production of chips in 3nm technology (N2 and A16 processes) will start in 2028.
- Third factory: The factory for production of chips in 2nm technology is scheduled to open by 2030.
This project will not only strengthen U.S. advanced technology manufacturing, but will also create tens of thousands of jobs. The U.S. regains its status as a leading chip manufacturer, which is strategically important for global technological independence.
The project will not only strengthen U.S. advanced technology manufacturing, but also create tens of thousands of jobs.
