Honor Magic 8 Air could be a compact flagship with a slim body and MediaTek chip
By ForGeeks
It looks like Honor is joining the growing trend of compact premium smartphones by preparing a new Honor Magic 8 Air. Fresh leaks indicate that the device will join the brand’s flagship lineup, which means it will offer advanced «hardware» and the series’ usual premium design. Below —s everything that’s known so far.
On the back of the growing popularity of compact flagships, Honor is becoming the next Chinese brand to bet on this segment. New details have come from renowned insider RODENT950, who shared key information in X. Despite its flagship status and top specs, the Magic 8 Air may reportedly ditch Qualcomm processors in favor of MediaTek. Unlike other models in the series, the smartphone is likely to be powered by a Dimensity 9500 chip instead of Snapdragon 8 Elite Gen 5.
The smartphone will likely be powered by a Dimensity 9500 chip instead of a Snapdragon 8 Elite Gen 5 chip.
According to the source, the device will get a 6.31-inch LTPS OLED display with about 1.5K resolution and 120Hz refresh rate. On the back, expect a 200MP main camera with a 1/1.5-inch sensor, as well as a 50MP telephoto lens. It is not yet clear whether the camera will include an ultra-wide-angle module. A battery with a capacity of about 5,500 mAh should be responsible for the autonomy.
The camera is expected to have a 1/1.5-inch sensor and a 50-pixel telephoto lens.
One of the most notable design features will be the ultra-thin body. As the name suggests, the model could compete with the iPhone Air: the leak hints at a body thickness of between 5-6mm. This looks particularly impressive considering the flagship specs and the rather large battery. According to preliminary reports, the Honor Magic 8 Air could be unveiled in the second half of January 2026.
